Invention Grant
- Patent Title: Test probe assembly and test socket
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Application No.: US16851319Application Date: 2020-04-17
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Publication No.: US11639945B2Publication Date: 2023-05-02
- Inventor: Jae-hwan Jeong , Geun-su Kim , Jung-chul Shin
- Applicant: LEENO INDUSTRIAL INC.
- Applicant Address: KR Busan
- Assignee: LEENO INDUSTRIAL INC.
- Current Assignee: LEENO INDUSTRIAL INC.
- Current Assignee Address: KR Busan
- Agency: Park & Associates IP Law Office
- Priority: KR10-2017-0147488 20171107,KR10-2018-0067907 20180614
- Main IPC: G01R1/067
- IPC: G01R1/067 ; G01R1/18 ; G01R3/00

Abstract:
A test probe assembly includes: a conductive pipe; a probe inserted in the pipe without contacts and elastically retractable along a lengthwise direction; and an insulation probe supporting member configured to support the probe between an inner wall of the pipe and an outer surface of the probe. The test probe assembly of the present disclosure is improved in noise shield performance and convenient in repairing the probe since the probe is mounted to a probe socket as supported in a metal pipe without contacts.
Public/Granted literature
- US20200241042A1 TEST PROBE ASSEMBLY AND TEST SOCKET Public/Granted day:2020-07-30
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