Invention Grant
- Patent Title: Composite part with integral electronic instrumentation circuit and its manufacturing method
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Application No.: US16761130Application Date: 2018-11-05
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Publication No.: US11639916B2Publication Date: 2023-05-02
- Inventor: Sabri Janfaoui , Rafik Hadjria
- Applicant: SAFRAN
- Applicant Address: FR Paris
- Assignee: SAFRAN
- Current Assignee: SAFRAN
- Current Assignee Address: FR Paris
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR1760375 20171106
- International Application: PCT/FR2018/052712 WO 20181105
- International Announcement: WO2019/086815 WO 20190509
- Main IPC: G01N29/24
- IPC: G01N29/24 ; H03H3/02 ; H05K1/02 ; H05K3/00 ; H05K1/18 ; H05K1/14 ; H05K3/46 ; H05K1/16

Abstract:
A composite part (sandwich or monolithic), including a rigid outer surface, to which is integrated an electronic instrumentation circuit, the electronic instrumentation circuit including a piezoelectric transducer, connected to a coil, an electronic control circuit, connected to a coil positioned facing the coil. The coil is printed on an insulating layer, printed directly on the rigid outer surface, the coil is printed on an insulating layer, covering the coil and the transducer, conducting tracks are printed on an insulating layer printed on at least one portion of the coil to be connected to it, the electronic control circuit being attached to the rigid outer surface and being connected to the tracks.
Public/Granted literature
- US20200271626A1 COMPOSITE PART WITH INTEGRAL ELECTRONIC INSTRUMENTATION CIRCUIT AND ITS MANUFACTURING METHOD Public/Granted day:2020-08-27
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