Invention Grant
- Patent Title: Micro-hinge for an electronic device
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Application No.: US16859452Application Date: 2020-04-27
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Publication No.: US11639623B2Publication Date: 2023-05-02
- Inventor: Bok Eng Cheah , Howe Yin Loo , Min Suet Lim , Jackson Chung Peng Kong , Poh Tat Oh
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Hanley, Flight & Zimmerman, LLC
- Main IPC: E05D3/06
- IPC: E05D3/06 ; G06F1/16 ; G06F1/3218 ; G06F1/3234 ; E05D11/00 ; H05K5/02

Abstract:
Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a low profile hinge design that includes a micro-hinge. The micro-hinge can couple a first element to a second element and can include a first attachment that couples to the first element, a second attachment that couples to the second element, and a plurality of linkages that couples the first attachment to the second attachment. The low profile hinge can further include a plurality of micro-hinges and a plurality of support rods.
Public/Granted literature
- US20200325711A1 MICRO-HINGE FOR AN ELECTRONIC DEVICE Public/Granted day:2020-10-15
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