Invention Grant
- Patent Title: Circularly symmetric tightly coupled dipole array
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Application No.: US17411813Application Date: 2021-08-25
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Publication No.: US11621500B2Publication Date: 2023-04-04
- Inventor: James B. West , Matilda G. Livadaru
- Applicant: Rockwell Collins, Inc.
- Applicant Address: US IA Cedar Rapids
- Assignee: Rockwell Collins, Inc.
- Current Assignee: Rockwell Collins, Inc.
- Current Assignee Address: US IA Cedar Rapids
- Agency: Suiter Swantz pc llo
- Main IPC: H01Q21/24
- IPC: H01Q21/24 ; H01Q1/36 ; H01Q9/46 ; H01Q7/00 ; H01Q9/28 ; H01Q1/38
Abstract:
An antenna array includes a printed circuit board including printed circuit board elements circumferentially disposed at locations on a surface of the printed circuit board. The printed circuit board elements are disposed in opposing pairs at diametrically opposite locations and include a first member and a second member. The first member intersects the second member which is curved. The antenna array can be an ultra-ultra wide band (UUWB) wavelength scaled array (WSA) tightly coupled dipole array (TCDA) active electronically scanned array (AESA) aperture.
Public/Granted literature
- US20210384646A1 CIRCULARLY SYMMETRIC TIGHTLY COUPLED DIPOLE ARRAY Public/Granted day:2021-12-09
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