Invention Grant
- Patent Title: Integrated circuit structures having partitioned source or drain contact structures
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Application No.: US16122284Application Date: 2018-09-05
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Publication No.: US11621354B2Publication Date: 2023-04-04
- Inventor: Mauro J. Kobrinsky , Stephanie Bojarski , Babita Dhayal , Biswajeet Guha , Tahir Ghani
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L27/092 ; H01L29/06 ; H01L29/417 ; H01L29/423 ; H01L21/8238 ; H01L21/02 ; H01L29/78

Abstract:
Integrated circuit structures having partitioned source or drain contact structures, and methods of fabricating integrated circuit structures having partitioned source or drain contact structures, are described. For example, an integrated circuit structure includes a fin. A gate stack is over the fin. A first epitaxial source or drain structure is at a first end of the fin. A second epitaxial source or drain structure is at a second end of the fin. A conductive contact structure is coupled to one of the first or the second epitaxial source or drain structures. The conductive contact structure has a first portion partitioned from a second portion.
Public/Granted literature
- US20200075771A1 INTEGRATED CIRCUIT STRUCTURES HAVING PARTITIONED SOURCE OR DRAIN CONTACT STRUCTURES Public/Granted day:2020-03-05
Information query
IPC分类: