Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17065235Application Date: 2020-10-07
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Publication No.: US11621344B2Publication Date: 2023-04-04
- Inventor: Wei-Sheng Yun , Shao-Ming Yu , Tung-Ying Lee , Chih-Chieh Yeh
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/08 ; H01L29/06 ; H01L29/786

Abstract:
A device includes a semiconductor fin, a first epitaxy structure and a gate stack. The semiconductor fin protrudes from a substrate. The first epitaxy feature laterally surrounds a first portion of the semiconductor fin. The gate stack laterally surrounds a second portion of the semiconductor fin above the first portion of the semiconductor fin, wherein the second portion of the semiconductor fin has a lower surface roughness than the first epitaxy feature.
Public/Granted literature
- US20210020763A1 SEMICONDUCTOR DEVICE Public/Granted day:2021-01-21
Information query
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