Invention Grant
- Patent Title: Solid-state imaging device and electronic device
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Application No.: US15961641Application Date: 2018-04-24
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Publication No.: US11621284B2Publication Date: 2023-04-04
- Inventor: Yusuke Uesaka , Atsuhiko Yamamoto
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2013-217006 20131018
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L27/146

Abstract:
The present invention relates to a solid-state imaging device. In a pixel array section in the solid-state imaging device, a vertical signal line is provided right under power supply wiring apart from a floating diffusion region in order to reduce load capacitance of the vertical signal line. Furthermore, the power supply wiring is wired to make a cover rate of each vertical signal line with respect to the power supply wiring nearly uniform. As a result, it is possible to suppress variation of load capacitance of the vertical signal line for each pixel. It becomes possible to suppress deviation in a black level, variation of charge transfer, and variation of settling. It becomes possible to obtain an image with higher quality.
Public/Granted literature
- US20180240825A1 SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE Public/Granted day:2018-08-23
Information query
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