Invention Grant
- Patent Title: Semiconductor package including an electromagnetic shield and method of fabricating the same
-
Application No.: US17453225Application Date: 2021-11-02
-
Publication No.: US11621233B2Publication Date: 2023-04-04
- Inventor: Youngwoo Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2019-0062815 20190528
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/552 ; H01L23/00 ; H01L23/31 ; H01L21/78 ; H01L21/56 ; H01L23/498
Abstract:
Disclosed are semiconductor packages and methods of fabricating the same. The method inluces forming a semiconductor chip, forming an electromagnetic shield that covers the semiconductor chip, and forming a molding that covers the electromagnetic shield. The electromagnetic shield is electrically connected to a conductor on a side of the semiconductor chip.
Public/Granted literature
- US20220059470A1 SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHOD OF FABRICATING THE SAME Public/Granted day:2022-02-24
Information query
IPC分类:
