Invention Grant
- Patent Title: Contact features and methods of fabricating the same in semiconductor devices
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Application No.: US16583697Application Date: 2019-09-26
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Publication No.: US11621224B2Publication Date: 2023-04-04
- Inventor: Li-Zhen Yu , Chia-Hao Chang , Cheng-Chi Chuang , Yu-Ming Lin , Chih-Hao Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L27/088 ; H01L21/8234 ; H01L23/528 ; H01L21/768

Abstract:
A semiconductor structure includes a metal gate structure (MG) disposed over a semiconductor substrate, gate spacers disposed on sidewalls of the MG, and a gate contact disposed on the MG. The semiconductor structure further includes an etch-stop layer (ESL) disposed on the gate spacers, and a source/drain (S/D) contact disposed adjacent to the gate spacers, where a top portion of the S/D contact defined by the ESL is narrower than a bottom portion of the S/D contact defined by the gate spacers.
Public/Granted literature
- US20210098364A1 Contact Features and Methods of Fabricating the Same in Semiconductor Devices Public/Granted day:2021-04-01
Information query
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