Invention Grant
- Patent Title: Systems and methods for optimizing RF plasma power coupling
-
Application No.: US17155885Application Date: 2021-01-22
-
Publication No.: US11621147B2Publication Date: 2023-04-04
- Inventor: Carl William Almgren , Daniel Robert Boughton , Kenneth Edward Hrdina , Stefan Wolfgang Kramel , Christopher Scott Thomas
- Applicant: CORNING INCORPORATED
- Applicant Address: US NY Corning
- Assignee: CORNING INCORPORATED
- Current Assignee: CORNING INCORPORATED
- Current Assignee Address: US NY Corning
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H03H7/38

Abstract:
A system, having: an RF power source; an RF matching network electrically coupled to the RF power source; an impedance matching circuit electrically coupled to the RF matching network, wherein the impedance matching circuit has a first adjustable capacitor connected in series with the RF matching network and a second adjustable capacitor connected in parallel with the first capacitor; and an inductive process load electrically coupled to the impedance matching circuit.
Public/Granted literature
- US20210384010A1 SYSTEMS AND METHODS FOR OPTIMIZING RF PLASMA POWER COUPLING Public/Granted day:2021-12-09
Information query