Invention Grant
- Patent Title: Relay
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Application No.: US17262214Application Date: 2019-02-19
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Publication No.: US11621136B2Publication Date: 2023-04-04
- Inventor: Shingo Mori , Ryota Minowa , Yasuo Hayashida , Naoki Kawaguchi , Kohei Otsuka , Hiroyuki Iwasaka
- Applicant: OMRON Corporation
- Applicant Address: JP Kyoto
- Assignee: OMRON Corporation
- Current Assignee: OMRON Corporation
- Current Assignee Address: JP Kyoto
- Agency: Shinjyu Global IP
- Priority: JPJP2018-154579 20180821
- International Application: PCT/JP2019/006169 WO 20190219
- International Announcement: WO2020/039619 WO 20200227
- Main IPC: H01H3/00
- IPC: H01H3/00 ; H01H50/54 ; H01H50/02 ; H01H50/14 ; H01H50/18

Abstract:
A relay includes a movable contact piece having a first movable contact and a second movable contact, a first fixed terminal having a first fixed contact, a second fixed terminal having a second fixed contact, a drive device configured to move the movable contact piece, and the wall portion disposed inside the first fixed contact and the second fixed contact in a longitudinal direction. At least a part of the wall portion is disposed at a position beyond the first fixed contact and the second fixed contact toward the movable contact piece in a moving direction of the movable contact piece. The movable contact piece has a shape so as to avoid the wall portion in a contact state where the first movable contact is in contact with the first fixed contact and the second movable contact is in contact with the second fixed contact.
Public/Granted literature
- US20210304994A1 RELAY Public/Granted day:2021-09-30
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