A system include multiple memory dice and a processing device coupled to the multiple memory dice. The processing device is to perform operations, including: reading temperature values from registers at multiple memory dice, wherein each temperature value is associated with a temperature at a respective die of the multiple memory dice; reading error-correcting code (ECC)-protected data from the multiple memory dice; determining whether an ECC check of the ECC-protected data results in detecting an error; in response to detecting the error from the ECC-protected data for a die of the multiple memory dice, performing a confirmation check that the error is a result of a defect in the die; and in response to the confirmation check confirming the die is defective, ignoring a temperature value from the die when determining whether to trigger a thermal-related operation.