Invention Grant
- Patent Title: Determination of optical roughness in EUV structures
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Application No.: US17814249Application Date: 2022-07-22
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Publication No.: US11619877B2Publication Date: 2023-04-04
- Inventor: Ravi K. Bonam , Gangadhara Raja Muthinti
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Joseph P. Curcuru
- Main IPC: G03F1/36
- IPC: G03F1/36 ; G03F7/20 ; G01B11/02 ; H01L21/66

Abstract:
A computer-implemented method for determining optical roughness in a semiconductor pattern structure that includes receiving, using a processor, optical responses spectra collected from the semiconductor pattern structure and constructing, using the processor optical critical dimension (OCD) models by using a set of input parameters for each layer of the semiconductor pattern structure. The method further includes calculating, using the processor, theoretical optical responses from a theoretical input generated by the OCD models. In addition, the method provides for comparing, using the processor, the optical responses spectra of the semiconductor pattern structure to the theoretical optical responses to determine output parameters for the optical roughness of the semiconductor pattern structure.
Public/Granted literature
- US20220357648A1 DETERMINATION OF OPTICAL ROUGHNESS IN EUV STRUCTURES Public/Granted day:2022-11-10
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