Invention Grant
- Patent Title: Probe head and die set having horizontally fine adjustable die and probe head adjusting method
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Application No.: US17565075Application Date: 2021-12-29
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Publication No.: US11619656B2Publication Date: 2023-04-04
- Inventor: Chin-Yi Lin , Keng-Min Su , Che-Wei Lin , Hsin-Cheng Hung
- Applicant: MPI CORPORATION
- Applicant Address: TW Chu-Pei
- Assignee: MPI CORPORATION
- Current Assignee: MPI CORPORATION
- Current Assignee Address: TW Chu-Pei
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW110106326 20210223,TW110121506 20210611
- Main IPC: G01R1/073
- IPC: G01R1/073

Abstract:
A probe head includes a middle die, upper and lower die units, at least one of which includes inner and outer dies detachably fastened to the middle die and each other, and a plurality of buckled probes inserted through the upper and lower die units. The inner die has an outer connecting surface connected with an inner surface of the outer die, where an installation recess is provided, an inner connecting surface connected with the middle die, and a probe installation section having a protruding portion protruding from the outer connecting surface and located in the installation recess, and a recessed portion recessed from the inner connecting surface and located correspondingly to the protruding portion. The protruding portion and the installation recess have a horizontal distance therebetween. Therefore, the outer die is horizontally fine adjustable to make the positions of the probes meet the requirement.
Public/Granted literature
- US20220214379A1 PROBE HEAD AND DIE SET HAVING HORIZONTALLY FINE ADJUSTABLE DIE AND PROBE HEAD ADJUSTING METHOD Public/Granted day:2022-07-07
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