Electronics modules according to embodiments of the present technology may include a circuit board having a first surface from which an electronic component extends and a second surface opposite the first surface. The circuit board may include a tie-bar residual extending from a sidewall of the circuit board beyond the width across the first surface. The modules may also include an overmold at least partially encapsulating the circuit board. The overmold may be characterized by a first height extending normal to the first surface of the circuit board across the width of the circuit board. The overmold may extend laterally beyond the width along a length of the first surface. The overmold may define a region about the tie-bar residual characterized by a recessed height. The overmold may define a notch recessed from an outer edge of the overmold. The notch may be located across the tie-bar residual.