Invention Grant
- Patent Title: Semiconductor memory device having composite dielectric film structure and methods of forming the same
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Application No.: US17474297Application Date: 2021-09-14
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Publication No.: US11600543B2Publication Date: 2023-03-07
- Inventor: Sheng-Chieh Chen , Chih-Ren Hsieh , Ming-Lun Lee , Wei-Ming Wang , Ming Chyi Liu
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsinchu
- Agency: The Marbury Law Group, PLLC
- Main IPC: H01L27/11524
- IPC: H01L27/11524 ; H01L29/423 ; H01L23/29 ; H01L27/11534 ; H01L27/11548 ; H01L27/11529 ; H01L29/417 ; H01L21/56 ; H01L29/66 ; H01L29/788 ; H01L21/28 ; H01L23/31

Abstract:
A semiconductor memory device and method of making the same are disclosed. The semiconductor memory device includes a substrate that includes a memory region and a peripheral region, a transistor including a metal gate located in the peripheral region, a composite dielectric film structure located over the metal gate of the transistor, the composite dielectric film structure including a first dielectric layer and a second dielectric layer over the first dielectric layer, where the second dielectric layer has a greater density than a density of the first dielectric layer, and at least one memory cell located in the memory region. The composite dielectric film structure provides enhanced protection of the metal gate against etching damage and thereby improves device performance.
Public/Granted literature
- US11637046B2 Semiconductor memory device having composite dielectric film structure and methods of forming the same Public/Granted day:2023-04-25
Information query
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