Invention Grant
- Patent Title: Detecting damaged semiconductor wafers utilizing a semiconductor wafer sorter tool of an automated materials handling system
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Application No.: US16915273Application Date: 2020-06-29
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Publication No.: US11600504B2Publication Date: 2023-03-07
- Inventor: Chen Min Lin , Hsien Tse Chen
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsinchu
- Agency: Harrity & Harrity, LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; G01N21/88 ; H01L21/66 ; G01N21/95
Abstract:
A device may detect a semiconductor wafer to be transferred from a source wafer carrier to a target wafer carrier, and may cause a light source to illuminate the semiconductor wafer. The device may cause a camera to capture images of the semiconductor wafer after the light source illuminates the semiconductor wafer, and may perform image recognition of the images of the semiconductor wafer to determine whether an edge of the semiconductor wafer is damaged. The device may cause the semiconductor wafer to be provided to the source wafer carrier when the edge of the semiconductor wafer is determined to be damaged, and may cause the semiconductor wafer to be provided to the target wafer carrier when the edge of the semiconductor wafer is determined to be undamaged.
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