Invention Grant
- Patent Title: Component supply device and component mounting device
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Application No.: US16754624Application Date: 2017-10-31
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Publication No.: US11576290B2Publication Date: 2023-02-07
- Inventor: Yukinari Awano
- Applicant: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Applicant Address: JP Iwata
- Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Current Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Current Assignee Address: JP Iwata
- Agency: Studebaker & Brackett PC
- International Application: PCT/JP2017/039223 WO 20171031
- International Announcement: WO2019/087270 WO 20190509
- Main IPC: H05K13/02
- IPC: H05K13/02 ; H05K13/04 ; H05K13/08
Abstract:
A component supply device includes a tape feeder configured to feed a tape including a storage configured to store a component and a cover tape configured to cover an upper side of the storage, and a press including a columnar protrusion configured to press an upper surface of a portion of the cover tape that covers the storage.
Public/Granted literature
- US20200315076A1 COMPONENT SUPPLY DEVICE AND COMPONENT MOUNTING DEVICE Public/Granted day:2020-10-01
Information query
