Invention Grant
- Patent Title: Substrate integrated waveguide fed antenna
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Application No.: US17335249Application Date: 2021-06-01
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Publication No.: US11575212B2Publication Date: 2023-02-07
- Inventor: Chi Hou Chan , Manting Wang
- Applicant: City University of Hong Kong
- Applicant Address: HK Kowloon
- Assignee: City University of Hong Kong
- Current Assignee: City University of Hong Kong
- Current Assignee Address: HK Kowloon
- Agency: Renner Kenner Greive Bobak Taylor & Weber
- Main IPC: H01Q19/00
- IPC: H01Q19/00 ; H01Q21/06 ; H01Q9/04

Abstract:
A substrate integrated waveguide fed antenna includes an electric dipole arrangement, a parasitic patch arrangement operably coupled with the electric dipole arrangement, and a feed structure. The feed structure includes a substrate integrated waveguide operably coupled with the electric dipole arrangement for exciting the electric dipole arrangement. A slotted conductive surface with a slot is arranged between the electric dipole arrangement and the feed structure for operably coupling the feed structure with the electric dipole arrangement.
Public/Granted literature
- US20210376479A1 SUBSTRATE INTEGRATED WAVEGUIDE FED ANTENNA Public/Granted day:2021-12-02
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