Invention Grant
- Patent Title: Robot blade having multiple sensors for multiple different alignment tasks
-
Application No.: US16900558Application Date: 2020-06-12
-
Publication No.: US11574837B2Publication Date: 2023-02-07
- Inventor: Wen-Hao Cheng , Yen-Yu Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Seed IP Law Group LLP
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/687 ; B25J11/00 ; B25J13/08 ; H01L21/683
Abstract:
A robot for transferring a wafer is disclosed. A blade of the robot includes a first sensor on an upper surface of the blade and the second sensor on a back surface of the blade. The first sensor is operable to align the blade with a wafer. The second sensor is operable to align the blade with a holder that holds the wafer.
Public/Granted literature
- US20210391206A1 ROBOT BLADE HAVING MULTIPLE SENSORS FOR MULTIPLE DIFFERENT ALIGNMENT TASKS Public/Granted day:2021-12-16
Information query
IPC分类:
