Invention Grant
- Patent Title: Thermal cutoff
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Application No.: US17293827Application Date: 2019-09-19
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Publication No.: US11574785B2Publication Date: 2023-02-07
- Inventor: Yaoxiang Hong
- Applicant: XIAMEN SET ELECTRONICS CO., LTD.
- Applicant Address: CN Xiamen
- Assignee: XIAMEN SET ELECTRONICS CO., LTD.
- Current Assignee: XIAMEN SET ELECTRONICS CO., LTD.
- Current Assignee Address: CN Xiamen
- Agency: Bayramoglu Law Offices LLC
- Priority: CN201920354677.3 20190320
- International Application: PCT/CN2019/106809 WO 20190919
- International Announcement: WO2020/186713 WO 20200924
- Main IPC: H01H85/38
- IPC: H01H85/38 ; H01H85/175 ; H01H85/12 ; H01H85/143 ; H01H85/042

Abstract:
A thermal cutoff includes a first fusible element, a second fusible element, and a closed cavity bounded by a housing having an open end, a cover plate, and a sealant. The two ends of the first fusible element and the two ends of the second fusible element are connected in parallel to a first electrode and a second electrode, respectively. The first fusible element and the second fusible element are provided in the closed cavity. A direction extending from a closed end to the open end of the housing is defined as a vertical direction. The first fusible element and the second fusible element are vertically arranged. The thermal cutoff has a vertical configuration and thus in its entirety has an elongated shape to meet corresponding application requirements.
Public/Granted literature
- US20220013319A1 THERMAL CUTOFF Public/Granted day:2022-01-13
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