Invention Grant
- Patent Title: Server chassis
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Application No.: US17446833Application Date: 2021-09-03
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Publication No.: US11547013B2Publication Date: 2023-01-03
- Inventor: Kuang-Yun Shen , Cheng-Feng Yang , Chih-Wei Hou
- Applicant: CHENBRO MICOM CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: CHENBRO MICOM CO., LTD.
- Current Assignee: CHENBRO MICOM CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: CKC & Partners Co., LLC
- Priority: TW107216724 20181207
- Main IPC: H05K7/14
- IPC: H05K7/14 ; H05K5/02 ; A47B96/02

Abstract:
A server chassis includes a housing and two support portions. A bottom plate of the housing includes a loading surface and a three-dimensional reinforcing pattern integrally formed on the loading surface for reinforcing the structural strength of the bottom plate. The support portions are respectively located on an outer surface of the sidewall of the housing. A coverage area of the three-dimensional reinforcing pattern is greater than 10% of the total area of the loading surface. The three-dimensional reinforcing pattern includes a plurality of texture patterns regularly reproduced on the loading surface toward a linear axial direction. The three-dimensional reinforcing pattern also includes a plurality of first arc portions and a plurality of second arc portions arranged in a staggered alignment.
Public/Granted literature
- US20210400834A1 SERVER CHASSIS Public/Granted day:2021-12-23
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