Invention Grant
- Patent Title: Multilayered transient liquid phase bonding
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Application No.: US16735967Application Date: 2020-01-07
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Publication No.: US11546998B2Publication Date: 2023-01-03
- Inventor: Bradley Paul Barber
- Applicant: SKYWORKS SOLUTIONS, INC.
- Applicant Address: US CA Irvine
- Assignee: SKYWORKS SOLUTIONS, INC.
- Current Assignee: SKYWORKS SOLUTIONS, INC.
- Current Assignee Address: US CA Irvine
- Agency: Lando & Anastasi, LLP
- Main IPC: H05K3/10
- IPC: H05K3/10 ; C23C28/02 ; B32B15/01 ; H01L21/321 ; H05K1/11 ; H05K1/18 ; H01L23/10 ; H01L23/00 ; H05K3/34 ; H01L21/50
Abstract:
A bonding structure includes a first layer of first alloy component disposed on a substrate and a first layer of a second alloy component disposed on the first alloy component. The second alloy component has a lower melting temperature than the first alloy component. A second layer of the first alloy component is disposed on the first layer of the second alloy component and a second layer of the second alloy component is disposed on the second layer of the first alloy component.
Information query
