Invention Grant
- Patent Title: Headphone ear pad system
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Application No.: US17301524Application Date: 2021-04-06
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Publication No.: US11546686B2Publication Date: 2023-01-03
- Inventor: Daniel William Clark , Robert Jason Egger
- Applicant: Dan Clark Audio, Inc.
- Applicant Address: US CA San Diego
- Assignee: Dan Clark Audio, Inc.
- Current Assignee: Dan Clark Audio, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Hall Estill Law Firm
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R1/10 ; H04R31/00
Abstract:
A headphone ear pad system may generate a custom ear pad from a three-dimensional data set of a user. The custom ear pad is attach to a headphone housing and is subsequently used to form an acoustic coupling with an ear of the user and an acoustic driver of the headphone housing. The custom ear pad can have a customized cross-sectional shape and sealing surface to create an optimized acoustic profile for the user.
Public/Granted literature
- US20220321990A1 HEADPHONE EAR PAD SYSTEM Public/Granted day:2022-10-06
Information query
