Invention Grant
- Patent Title: Modular architecture for adding a sensor service at a monitored location
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Application No.: US16231370Application Date: 2018-12-21
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Publication No.: US11546677B2Publication Date: 2023-01-03
- Inventor: Julien G. Stamatakis
- Applicant: Senseware, Inc.
- Applicant Address: US VA Vienna
- Assignee: Senseware, Inc.
- Current Assignee: Senseware, Inc.
- Current Assignee Address: US VA Vienna
- Main IPC: H04Q9/00
- IPC: H04Q9/00 ; G01D4/00 ; H04W84/18 ; H04W4/70 ; H04W4/80 ; H04L67/12 ; H04L12/40 ; H04L67/02 ; H04L67/125 ; H04W4/021 ; F24F11/58 ; G06F3/0482 ; G06F3/04842 ; G08C19/00 ; H04L41/0806 ; H04W24/02 ; H04L43/10 ; H04L67/10 ; H04L41/04 ; H04W4/38 ; F24F11/30 ; B60H1/00 ; H04B1/38 ; G08B19/00 ; H04W92/06 ; H04W88/16 ; F24F110/00 ; F24F11/00
Abstract:
A universal sensor interface enables selective coupling of one or more sensor module units to a wireless node. Each sensor module unit can contain a suite of sensors selected for a particular sensor application at a monitored location. Reconfiguration of the wireless sensor network can occur seamlessly through the plug-and-play connectivity between the sensor module units and the wireless node.
Public/Granted literature
- US20190222909A1 Sensor Deployment Mechanism at a Monitored Location Public/Granted day:2019-07-18
Information query
