Invention Grant
- Patent Title: Solid-state imaging device
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Application No.: US17084583Application Date: 2020-10-29
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Publication No.: US11546542B2Publication Date: 2023-01-03
- Inventor: Atsumi Niwa
- Applicant: Sony Semiconductor Solutions Corporation
- Applicant Address: JP Kanagawa
- Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: JPJP2017-209045 20171030
- Main IPC: H04N5/369
- IPC: H04N5/369 ; H04N5/3745 ; H01L27/146

Abstract:
A mounting area in a solid-state imaging device that detects an address event. The solid-state imaging device includes a light receiving chip and a detection chip. In the solid-state imaging device including the light receiving chip and the detection chip, the light receiving chip includes a photodiode that photoelectrically converts incident light and generates a photocurrent. In addition, in the solid-state imaging device, the detection chip quantizes a voltage signal corresponding to the photocurrent generated by the photodiode in the light receiving chip and outputs the voltage signal as a detection signal.
Public/Granted literature
- US20210051288A1 SOLID-STATE IMAGING DEVICE Public/Granted day:2021-02-18
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