Invention Grant
- Patent Title: Cover for an electronic circuit package
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Application No.: US17169010Application Date: 2021-02-05
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Publication No.: US11546059B2Publication Date: 2023-01-03
- Inventor: Jean-Michel Riviere , Romain Coffy , Karine Saxod
- Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
- Applicant Address: FR Grenoble
- Assignee: STMICROELECTRONICS (GRENOBLE 2) SAS
- Current Assignee: STMICROELECTRONICS (GRENOBLE 2) SAS
- Current Assignee Address: FR Grenoble
- Agency: Seed Intellectual Property Law Group LLP
- Priority: FR1762276 20171215
- Main IPC: H04B10/40
- IPC: H04B10/40 ; H05K7/02 ; H05K5/03 ; H04B10/80 ; H01L31/16 ; H01L31/0203
Abstract:
A cover for an electronic circuit package, including: a body having an opening extending therethrough; a first element located in the opening and having a surface continuing planar or rounded shapes of a surface of the cover; and a second element of connection of the first element to the body.
Public/Granted literature
- US20210159985A1 COVER FOR AN ELECTRONIC CIRCUIT PACKAGE Public/Granted day:2021-05-27
Information query
