Invention Grant
- Patent Title: Apparatus for minimizing electromagnetic coupling between surface mount device inductors
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Application No.: US16707776Application Date: 2019-12-09
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Publication No.: US11546019B2Publication Date: 2023-01-03
- Inventor: John C. Baldwin , Weimin Sun
- Applicant: Skyworks Solutions, Inc.
- Applicant Address: US MA Woburn
- Assignee: Skyworks Solutions, Inc.
- Current Assignee: Skyworks Solutions, Inc.
- Current Assignee Address: US MA Woburn
- Agency: Knobbe, Martens, Olson & Bear LLP
- Main IPC: H04B5/00
- IPC: H04B5/00 ; H05K1/02 ; H01F27/28 ; H01F27/32 ; H01F27/36
Abstract:
A surface mount device inductor has a package casing sized to attenuate electromagnetic coupling between the inductor coils of the surface mount device inductors. The package casing makes the surface mount device inductors self-shielding. The surface mount device inductors can be incorporated into a radiofrequency module, and can be incorporated into a front end system of a wireless mobile device.
Public/Granted literature
- US20200186202A1 APPARATUS FOR MINIMIZING ELECTROMAGNETIC COUPLING BETWEEN SURFACE MOUNT DEVICE INDUCTORS Public/Granted day:2020-06-11
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