Invention Grant
- Patent Title: Semiconductor laser element
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Application No.: US16646977Application Date: 2018-08-09
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Publication No.: US11545812B2Publication Date: 2023-01-03
- Inventor: Atsunori Mochida
- Applicant: PANASONIC CORPORATION
- Applicant Address: JP Osaka
- Assignee: PANASONIC CORPORATION
- Current Assignee: PANASONIC CORPORATION
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JPJP2017-180002 20170920
- International Application: PCT/JP2018/029858 WO 20180809
- International Announcement: WO2019/058802 WO 20190328
- Main IPC: H01S5/22
- IPC: H01S5/22 ; H01S5/40

Abstract:
A semiconductor laser element includes: a substrate; and a laser array portion that includes a plurality of light emitting portions arranged side by side, and is stacked above the substrate, wherein a stacked body of the substrate and the laser array portion includes a pair of resonator end faces on opposite faces, and a groove portion that extends from the laser array portion into the substrate is provided on at least one of the pair of resonator end faces between two adjacent light emitting portions among the plurality of light emitting portions.
Public/Granted literature
- US20200212655A1 SEMICONDUCTOR LASER ELEMENT Public/Granted day:2020-07-02
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