A method for producing a connecting device for connecting films with conductor tracks includes the steps of laying a first film with conductor tracks onto a forming die, applying a first lower shell of a plastic material onto a first end portion of the forming die, producing a cut-out and shifting the first film so that the cut-out lies completely on the first lower shell, applying upper conductor tracks of a conductive material onto the first lower shell so that the upper conductor tracks overlap with the conductor tracks of the first film, and applying a first upper shell of a plastic material onto the first lower shell so that the first film, the first lower shell and the first upper shell connect together by substance bonding to form a first connector. In this way, an integral connector can be provided on each film.