Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17336012Application Date: 2021-06-01
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Publication No.: US11545564B2Publication Date: 2023-01-03
- Inventor: Kenji Suzuki , Koichi Nishi , Katsumi Nakamura , Ze Chen , Koji Tanaka
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JPJP2020-139105 20200820
- Main IPC: H01L29/739
- IPC: H01L29/739 ; H01L29/66 ; H01L29/06

Abstract:
A semiconductor device includes an N-type drift layer provided between a first main surface and a second main surface of the semiconductor substrate and an N-type buffer layer provided between the N-type drift layer and the first main surface and having a higher impurity peak concentration than the N-type drift layer. The N-type buffer layer has a structure that a first buffer layer, a second buffer layer, a third buffer layer, and a fourth buffer layer are disposed in this order from a side of the first main surface. When a distance from an impurity peak position of the first buffer layer to an impurity peak position of the second buffer layer is L12 and a distance from an impurity peak position of the second buffer layer to an impurity peak position of the third buffer layer is L23, a relationship of L23/L12≥3.5 is satisfied.
Public/Granted literature
- US20220059681A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-02-24
Information query
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