Invention Grant
- Patent Title: Static random access memory
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Application No.: US17032820Application Date: 2020-09-25
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Publication No.: US11545496B2Publication Date: 2023-01-03
- Inventor: Yong Li
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation , Semiconductor Manufacturing International (Beijing) Corporation
- Applicant Address: CN Shanghai; CN Beijing
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee Address: CN Shanghai; CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: CN201710651016.2 20170802
- Main IPC: H01L29/165
- IPC: H01L29/165 ; H01L27/11 ; H01L21/8238 ; H01L29/06 ; H01L29/66 ; G11C11/412 ; H01L29/78

Abstract:
An SRAM (static random access memory) includes a semiconductor substrate; a plurality of PD transistors, each including a first fin structure formed on the semiconductor substrate, a PD gate structure formed across the first fin structure and covering a portion of a top and sidewall surfaces of the first fin structure, and a first source/drain doped layer formed in the first fin structure on both sides of the PD gate structure; a plurality of adjacent transistors, each including a second fin structure formed on the semiconductor substrate and a second source/drain doped layer formed in the second fin structure; an isolation layer, formed on the semiconductor substrate; a fin sidewall film, formed on the isolation layer and covering sidewall surfaces of each PD gate structure; and a first PD dielectric layer, formed on the isolation layer and covering sidewall surfaces of the first source/drain doped layer.
Public/Granted literature
- US20210013215A1 STATIC RANDOM ACCESS MEMORY Public/Granted day:2021-01-14
Information query
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