Invention Grant
- Patent Title: Semiconductor structure and method for forming the same
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Application No.: US16895795Application Date: 2020-06-08
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Publication No.: US11545490B2Publication Date: 2023-01-03
- Inventor: Jin-Aun Ng , Yu-Chao Lin , Tung-Ying Lee
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H01L21/324 ; H01L27/088 ; H01L29/423 ; H01L29/06 ; H01L21/8234 ; H01L29/66 ; H01L21/762 ; H01L21/306

Abstract:
A semiconductor structure is provided. The semiconductor structure includes a first gate-all-around FET over a substrate, and the first gate-all-around FET includes first nanostructures and a first gate stack surrounding the first nanostructures. The semiconductor structure also includes a first FinFET adjacent to the first gate-all-around FET, and the first FinFET includes a first fin structure and a second gate stack over the first fin structure. The semiconductor structure also includes a gate-cut feature interposing the first gate stack of the first gate-all-around FET and the second gate stack of the first FinFET.
Public/Granted literature
- US20210183855A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2021-06-17
Information query
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