A three-dimensional optoelectronic device package is disclosed. The three-dimensional optoelectronic device package comprises a first board having at least one surface on which a plurality of optoelectronic devices is disposed, and a second board having at least one surface on which a plurality of optoelectronic devices is disposed. A side of the second board is attached to the surface of the first board on which a plurality of optoelectronic devices is disposed to form an angle between the surface of the first board on which a plurality of optoelectronic devices is disposed and the surface of the second board on which a plurality of optoelectronic devices is disposed. A method for manufacturing a three-dimensional optoelectronic device package is also disclosed.