A semiconductor device including a semiconductor substrate including an electrode; a wire connected to the electrode; a first insulating film including a first opening that partially exposes the wire; a base portion that is connected to a portion of the wire exposed via the first opening, and that includes a conductor including a recess corresponding to the first opening; and a solder film on a surface of the base portion. Solder included in the solder film is fused by a first heat treatment, and the recess is filled with the fused solder.