Invention Grant
- Patent Title: Thermal conduction sheet and heat dissipating device including thermal conduction sheet
-
Application No.: US16970156Application Date: 2018-02-16
-
Publication No.: US11545413B2Publication Date: 2023-01-03
- Inventor: Mika Kobune , Michiaki Yajima
- Applicant: Hitachi Chemical Company, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery, LLP
- International Application: PCT/JP2018/005589 WO 20180216
- International Announcement: WO2019/159340 WO 20190822
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H05K7/20 ; F28F21/02 ; F28F13/00

Abstract:
Provided is a thermal conduction sheet, including graphite particles (A) of at least one kind selected from the group consisting of flake-shaped particles, ellipsoidal particles, and rod-shaped particles, in which: when the graphite particles (A) are flake-shaped particles, a planar direction of the graphite particles (A) is oriented in a thickness direction of the thermal conduction sheet, when the graphite particles (A) are ellipsoidal particles, a major axis direction of the graphite particles (A) is oriented in the thickness direction of the thermal conduction sheet, when the graphite particles (A) are rod-like particles, a longitudinal direction of the graphite particles (A) is oriented in the thickness direction of the thermal conduction sheet, the thermal conduction sheet has an elastic modulus of 1.4 MPa or less under a compression stress of 0.1 MPa at 150° C., and the thermal conduction sheet has a tack strength of 5.0 N·mm or higher at 25° C.
Information query
IPC分类: