- Patent Title: FinFET EPI channels having different heights on a stepped substrate
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Application No.: US16696327Application Date: 2019-11-26
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Publication No.: US11545399B2Publication Date: 2023-01-03
- Inventor: Cheng-Han Lee , Chih-Yu Ma , Shih-Chieh Chang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L21/02 ; H01L27/092 ; H01L29/78

Abstract:
A structure includes a stepped crystalline substrate that includes an upper step, a lower step, and a step rise. A first fin includes a crystalline structure having a first lattice constant. The first fin is formed over the lower step. A second fin includes a crystalline structure having a second lattice constant, the second lattice constant being different than the first lattice constant. The second fin can be formed over the upper step apart from the first fin. A second crystalline structure can be formed over the first crystalline structure and the tops of the fins aligned. The first and second fins can be made of the same material, but with different heights and different channel strain values. The first fin can be used as an NMOS fin and the second fin can be used as a PMOS fin of a CMOS FinFET.
Public/Granted literature
- US20200098645A1 FinFET EPI Channels Having Different Heights on a Stepped Substrate Public/Granted day:2020-03-26
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