Invention Grant
- Patent Title: Conductive interconnects and methods of forming conductive interconnects
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Application No.: US16787321Application Date: 2020-02-11
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Publication No.: US11545391B2Publication Date: 2023-01-03
- Inventor: Raju Ahmed , Frank Speetjens , Darin S. Miller , Siva Naga Sandeep Chalamalasetty , Dave Pratt , Yi Hu , Yung-Ta Sung , Aaron K. Belsher , Allen R. Gibson
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/522
Abstract:
Some embodiments include a method of forming an integrated assembly. An arrangement is formed to include a conductive pillar extending through an insulative mass. An upper surface of the conductive pillar is recessed to form a cavity. An insulative collar is formed within the cavity to line an outer lateral periphery of the cavity. A recessed surface of the conductive pillar is exposed at a bottom of the lined cavity. A conductive expanse is formed over the insulative mass. A portion of the conductive expanse extends into the cavity and is configured as an interconnect. The conductive expanse is patterned into multiple conductive structures. One of the conductive structures includes the interconnect.
Public/Granted literature
- US20210249304A1 Conductive Interconnects and Methods of Forming Conductive Interconnects Public/Granted day:2021-08-12
Information query
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