Invention Grant
- Patent Title: Substrate processing apparatus, substrate processing method and recording medium
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Application No.: US17136134Application Date: 2020-12-29
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Publication No.: US11545377B2Publication Date: 2023-01-03
- Inventor: Seiji Nakano
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JPJP2017-118807 20170616
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677 ; G03F7/16 ; H01L21/66

Abstract:
An apparatus includes first load ports 2A and 2B and second load ports 2C and 2D provided in a left-right direction; a processing unit D2; an inspection module 4 provided between the first load ports 2A and 2B and the second load ports 2C and 2D; a first substrate transfer mechanism 5A provided at one side of the inspection module 4 in the left-right direction, and configured to transfer a substrate W into the processing unit D2 and a transfer container C on the first load ports 2A and 2B; a second substrate transfer mechanism 5B provided at the other side thereof, and configured to transfer the substrate W into the inspection module 4 and a transfer container C on the second load ports 2C and 2D; and a transit unit 51 for transferring the substrate W between the first and the second substrate transfer mechanisms 5A and 5B.
Public/Granted literature
- US20210118711A1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND RECORDING MEDIUM Public/Granted day:2021-04-22
Information query
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