Invention Grant
- Patent Title: Process monitor for wafer thinning
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Application No.: US17340944Application Date: 2021-06-07
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Publication No.: US11545366B2Publication Date: 2023-01-03
- Inventor: Stephen L. Morein
- Applicant: Synaptics Incorporated
- Applicant Address: US CA San Jose
- Assignee: Synaptics Incorporated
- Current Assignee: Synaptics Incorporated
- Current Assignee Address: US CA San Jose
- Agency: Paradice & Li LLP
- Main IPC: H01L21/304
- IPC: H01L21/304 ; B24B37/013 ; H01L21/321 ; H01L21/66 ; B24B49/10 ; H01L21/683 ; H01L21/306 ; B24B37/04
Abstract:
A system and method for thinning an integrated circuit (IC) wafer. The system includes a support structure to hold the IC wafer and a mechanism to operate on the IC wafer. The support structure includes one or more inductive coils configured to transmit a power signal to the IC wafer and receive a feedback signal from the IC wafer. The system further includes a process controller to control the operation based at least in part on the feedback signal received from the IC wafer.
Public/Granted literature
- US20210296138A1 PROCESS MONITOR FOR WAFER THINNING Public/Granted day:2021-09-23
Information query
IPC分类:
