Invention Grant
- Patent Title: Method and apparatus for coating photo resist over a substrate
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Application No.: US17037785Application Date: 2020-09-30
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Publication No.: US11545361B2Publication Date: 2023-01-03
- Inventor: Tung-Hung Feng , Hui-Chun Lee , Sheng-Wen Jiang , Shih-Che Wang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L21/027
- IPC: H01L21/027 ; H01L21/67 ; H01L21/033 ; G03F7/20
Abstract:
In a method of coating a photo resist over a wafer, dispensing the photo resist from a nozzle over the wafer is started while rotating the wafer, and dispensing the photo resist is stopped while rotating the wafer. After starting and before stopping the dispensing the photo resist, a wafer rotation speed is changed at least 4 times. During dispensing, an arm holding the nozzle may move horizontally. A tip end of the nozzle may be located at a height of 2.5 mm to 3.5 mm from the wafer.
Public/Granted literature
- US20210343521A1 METHOD AND APPARATUS FOR COATING PHOTO RESIST OVER A SUBSTRATE Public/Granted day:2021-11-04
Information query
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