Invention Grant
- Patent Title: Protective material ring
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Application No.: US16613856Application Date: 2018-03-07
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Publication No.: US11545345B2Publication Date: 2023-01-03
- Inventor: Atsushi Ikari , Satoshi Fujii
- Applicant: THINKON NEW TECHNOLOGY JAPAN CORPORATION
- Applicant Address: JP Tokyo
- Assignee: THINKON NEW TECHNOLOGY JAPAN CORPORATION
- Current Assignee: THINKON NEW TECHNOLOGY JAPAN CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Wentsler LLC
- Priority: JPJP2017-098538 20170517
- International Application: PCT/JP2018/008869 WO 20180307
- International Announcement: WO2018/211787 WO 20181122
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01J37/24

Abstract:
Provided is a protective material ring in which a plurality of silicon members are joined. A protective material ring is to be installed in a treatment chamber of a substrate treatment apparatus performing plasma treatment on a substrate, and the substrate is accommodated in the treatment chamber. The protective material ring includes: three or more silicon members; and a joining part joining the silicon members. The joining part contains boron oxide.
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