Invention Grant
- Patent Title: Apparatus for monitoring pulsed high-frequency power and substrate processing apparatus including the same
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Application No.: US17089041Application Date: 2020-11-04
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Publication No.: US11545340B2Publication Date: 2023-01-03
- Inventor: Jong Hwan An , Shin-Woo Nam , Hong Won Lee , Jae Bak Shim
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Cheonan-si
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Cheonan-si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: H01J37/32
- IPC: H01J37/32 ; G01R23/04 ; G01R23/10 ; G01R29/02 ; H02M7/04 ; H03H7/24 ; H03H7/38 ; G01R21/12

Abstract:
Disclosed are an apparatus for monitoring pulsed high-frequency power and a substrate processing apparatus including the same. The apparatus includes an attenuation module configured to attenuate a pulsed high-frequency power signal; a rectifier module configured to convert the pulsed high-frequency power signal into a direct current signal; and a detection module configured to detect a pulse parameter based on the direct current signal.
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