Invention Grant
- Patent Title: Mold for forming a radio frequency (RF) coil for a plasma processing apparatus
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Application No.: US16752446Application Date: 2020-01-24
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Publication No.: US11545302B2Publication Date: 2023-01-03
- Inventor: Michael Hummel
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Slater Matsil, LLP
- Main IPC: H01F7/06
- IPC: H01F7/06 ; H01F41/04 ; B29C41/40 ; B29C64/141

Abstract:
Various embodiments of molds and methods are disclosed herein for fabricating a radio frequency (RF) coil. The disclosed mold includes a cylindrical inner core having a first helically shaped groove formed within an outer surface of the cylindrical inner core, and a two-piece compression sleeve having a second helically shaped groove formed within an inner surface of the two-piece compression sleeve. When portions of the two-piece compression sleeve are attached together, the two-piece compression sleeve surrounds the cylindrical inner core and provide a compressive force to a conductor arranged within the first and second helically shaped grooves to fabricate the RF coil. In some embodiments, a three-dimensional (3D) printing process may be used to fabricate each piece of the mold separately.
Public/Granted literature
- US20210233706A1 MOLD AND METHOD OF FORMING A RADIO FREQUENCY (RF) COIL FOR A PLASMA PROCESSING APPARATUS Public/Granted day:2021-07-29
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