Invention Grant
- Patent Title: Copper alloy wire, cable, and method of manufacturing copper alloy wire
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Application No.: US16538106Application Date: 2019-08-12
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Publication No.: US11545277B2Publication Date: 2023-01-03
- Inventor: Kazuhisa Takahashi , Shohei Hata , Hiromitsu Kuroda , Toru Sumi , Kazuya Nishi , Keisuke Fujito , Takayuki Tuji
- Applicant: Hitachi Metals, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- Priority: JPJP2018-160955 20180830,JPJP2019-130842 20190716
- Main IPC: H01B1/02
- IPC: H01B1/02 ; C22C9/00 ; C22F1/08 ; H01B13/00

Abstract:
Bendability of a copper alloy wire is improved without decrease in an electrical conductivity of the copper alloy wire made of copper alloy containing zirconium. A cable includes: a two-core stranded wire formed by intertwining two electrical wires made of a conductor and an insulating layer covering the conductor; a filler formed around the two-core stranded wire; and a sheath formed around the filler and the electrical wire. The conductor is a copper alloy wire in which a precipitate containing the zirconium disperses, and has a crystal gain diameter that is equal to or smaller than 1 μm, an electrical conductivity that is equal to or higher than 87% IACS, and a tensile stress that is equal to or larger than 545 MPa.
Public/Granted literature
- US20200075193A1 Copper Alloy Wire, Cable, and Method of Manufacturing Copper Alloy Wire Public/Granted day:2020-03-05
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