Invention Grant
- Patent Title: Resistive memory device
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Application No.: US17361534Application Date: 2021-06-29
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Publication No.: US11545214B2Publication Date: 2023-01-03
- Inventor: Masayuki Terai
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2020-0084356 20200708,KR10-2020-0174730 20201214
- Main IPC: G11C11/00
- IPC: G11C11/00 ; G11C13/00 ; H01L27/24 ; H01L45/00

Abstract:
A resistive memory device includes a first word line extending in a first horizontal direction, a second word line extending on the first word line in the first horizontal direction, a third word line extending on the second word line in the first horizontal direction, a first bit line extending between the first and second word lines in a second horizontal direction, a second bit line extending between the second and third word lines in the second horizontal direction, and memory cells respectively arranged between the first word line and the first bit line, between the first bit line and the second word line, between the second word line and the second bit line, and between the second bit line and the third word line. A thickness of the second word line is greater than a thickness of each of the first word line and the third word line.
Public/Granted literature
- US20220013171A1 RESISTIVE MEMORY DEVICE Public/Granted day:2022-01-13
Information query