Invention Grant
- Patent Title: Apparatuses and methods for different IO widths for stacked die
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Application No.: US17210922Application Date: 2021-03-24
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Publication No.: US11545189B2Publication Date: 2023-01-03
- Inventor: Scott Eugene Smith
- Applicant: MICRON TECHNOLOGY, INC.
- Applicant Address: US ID Boise
- Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee Address: US ID Boise
- Agency: Dorsey & Whitney LLP
- Main IPC: G11C5/04
- IPC: G11C5/04 ; G11C5/06 ; G06F3/06 ; G11C11/4096 ; G11C11/4093

Abstract:
Apparatuses and methods for providing data from stacked memory are described. The stacked memory may include multiple die. In some examples, a master die may receive data from one or more slave die. The master die may provide data from the master die and the data from the one or more slave die to a plurality of output terminals. Different ones of the output terminals may provide data from a different die of the stacked memory. In some examples, the data may be retrieved from the multiple die concurrently.
Public/Granted literature
- US20210312954A1 APPARATUSES AND METHODS FOR DIFFERENT IO WIDTHS FOR STACKED DIE Public/Granted day:2021-10-07
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