Invention Grant
- Patent Title: Hinge mechanism and electronic device
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Application No.: US17207104Application Date: 2021-03-19
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Publication No.: US11543862B2Publication Date: 2023-01-03
- Inventor: Chun Ren
- Applicant: Lenovo (Beijing) Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: Lenovo (Beijing) Co., Ltd.
- Current Assignee: Lenovo (Beijing) Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: CN202010617064.1 20200630
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
A hinge mechanism includes a hinge assembly connected with a first body and a second body to rotatably connect the first body and the second body, and a torque assembly mounted at the first body and connected with the hinge assembly. When the first body and the second body are relatively rotated to drive the hinge assembly, the hinge assembly drives the torque assembly to cause at least a part of the torque assembly to translate relative to the first body to provide a torque for the hinge assembly.
Public/Granted literature
- US20210405712A1 Hinge Mechanism and Electronic Device Public/Granted day:2021-12-30
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