Invention Grant
- Patent Title: Processing method and system for color film substrate
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Application No.: US17041583Application Date: 2018-11-29
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Publication No.: US11543706B2Publication Date: 2023-01-03
- Inventor: Huailiang He
- Applicant: HKC Corporation Limited
- Applicant Address: CN Guangdong
- Assignee: HKC Corporation Limited
- Current Assignee: HKC Corporation Limited
- Current Assignee Address: CN Guangdong
- Agency: Hauptman Ham, LLP
- Priority: CN201811339916.4 20181112
- International Application: PCT/CN2018/118140 WO 20181129
- International Announcement: WO2020/097992 WO 20200522
- Main IPC: G02F1/1339
- IPC: G02F1/1339 ; G02F1/13 ; B08B3/08 ; G02F1/1335

Abstract:
A processing method for a color film substrate, the color film substrate comprising a substrate, a photoresist layer, a conductive layer and a spacer layer. The photoresist layer is disposed on the substrate; the conductive layer is disposed on the photoresist layer and completely covers the photoresist layer; and the spacer layer is disposed on the conductive layer. The method comprises: detecting the spacer layer; determining whether the spacer layer meets a preset condition; if the spacer layer meets the preset condition, removing the spacer layer using a rework liquid medicine so as to expose the conductive layer; and re-preparing a spacer layer on the exposed conductive layer, wherein the etching selection ratio of the spacer layer to the conductive layer is greater than 1.
Public/Granted literature
- US20210018785A1 PROCESSING METHOD AND SYSTEM FOR COLOR FILM SUBSTRATE Public/Granted day:2021-01-21
Information query
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