Invention Grant
- Patent Title: Encapsulation methods for fluid-communicating magnetoelastic sensors
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Application No.: US16841323Application Date: 2020-04-06
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Publication No.: US11543465B2Publication Date: 2023-01-03
- Inventor: Scott Green , Yogesh B. Gianchandani , Richard Kwon , Grace Elta , Jiqing Jiang , Ramprasad Nambisan
- Applicant: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
- Applicant Address: US MI Ann Arbor
- Assignee: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
- Current Assignee: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
- Current Assignee Address: US MI Ann Arbor
- Agency: Marshall, Gerstein & Borun LLP
- Main IPC: G01R33/18
- IPC: G01R33/18 ; G01R33/00 ; G01R33/36 ; A61F2/82 ; A61B5/00

Abstract:
Encapsulation packages for stent-deployable monitoring devices formed of resonator sensors and allowing for magnetic biasing elements that exhibit a targeted impact on the mechanical characteristics of a stent are provided. Encapsulation packages are formed of different types and include a longitudinal shield and curved end on profile for aligning the shield within the deployable stent, the shield having perforations such that a resonator can be positioned adjacent the perforations for allowing particulate within the stent to collect and be measured by the resonator during deployment.
Public/Granted literature
- US20200319268A1 Encapsulation Methods for Fluid-Communicating Magnetoelastic Sensors Public/Granted day:2020-10-08
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